Samsung is expected to more than double output of its HBM4 and HBM4E DRAM (en.sedaily.com)

Article summary

Samsung is expected to more than double its production of HBM4 and HBM4E DRAM next year, with a planned increase in glass carrier production and a shift in output towards these high-bandwidth memory chips. This expansion is expected to lead to a decrease in the production of consumer-grade DRAM. The company's total DRAM production capacity is expected to grow to 250,000 wafers per month, with HBM4 and HBM4E making up 80% of output. The increase in HBM production is driven by growing demand from data centers and AI applications.

Main themes

• DRAM production
• HBM expansion
• price trends
• industry collusion
• AI and data center demand
• supply and demand imbalance

What commenters say

• The shift in production towards HBM will lead to higher prices for consumer-grade DRAM due to decreased supply.
• The market will eventually correct itself and lead to lower prices for DRAM as supply and demand balance out.
• The DRAM industry is prone to price fixing and collusion, which will prevent prices from decreasing despite changes in supply and demand.
• The increased production of HBM will not be enough to meet the growing demand for AI and data center applications.
• The expansion of HBM production will lead to a decrease in the production of other types of memory, such as DDR5.
• The industry's focus on HBM production will lead to a shortage of consumer-grade DRAM, causing prices to rise.
• The market will not be able to correct itself in the short term, leading to a prolonged period of high prices for DRAM.